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Micro Delta T AB

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µΔT Heat Exchanger

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THe Best Refrigator Heat Exchanger Solution in the World



µΔT has developed a surface modification technique for enhanced boiling. This technique has a tremendous impact on the performance of heat exchangers in a wide range of applications; varying from microelectronics cooling, home refrigeration, to large scale industrial boiling applications. At certain heat flux, the heat transfer coefficient for the developed surface is enhanced over 17 times compared to a plain reference surface. It's estimated that such an effective boiling surface would improve the energy efficiency of many heat pumping machines with 10 - 20 %. This technique has also been applied to the surface to the refrigerant side of a standard gasketed plate heat exchanger and found that the overall performance (UA value) of the heat exchanger improved about 100% in oil free R-134a (used in most A/C and domestic refrigerators) tests. The micro-porous enhancement technology can be applied to all types of geometries, including plate and shell-and-tube heat exchangers.

Main application areas:

  •    -Evaporators (plates and tubes)
  •    -Microelectronics cooling

Europe is the largest market, and is estimated to account for 45.7 % of total PLATE and FRAME heat exchangers sales in 2008. New types of plate patterns are in the following years expected to combat the plateau sales in the highly mature standard plate and frame exchanger market. Heat exchangers are also getting increasingly compact and efficient, and many companies are currently working with the miniaturization of existing heat exchange technologies.

Approximately 15% of all electricity produced in the world is used for running heat pumping equipment. For each degree, the temperature difference between the heat source and the evaporating fluid is reduced; the electricity need for running the system is decreased by 2 - 3%. Considering that a five degree reduction, could save us up to 20% in energy consumption and that billions of dollars are spent annually to power heat pumping machines, the patented technology can provide tremendous business opportunities for heat exchange manufacturers.

By using our product, customers (producers of heat exchangers), and/or the end user of our customers' heat exchangers, will:

  • Improve the energy efficiency in heat pumping systems,
  • Reduce the size and cost of their heat exchangers,

Develop new markets for their products by extending the application areas of their heat exchangers,

Improve their profitability and market share.

The developed surface structure is a nanostructured macro-porous (NMp) structure comprising of well-ordered micron-sized pores and dendritically ordered Cu branches with nano-sized voids, as can be seen from the scanning electron microscopy (SEM) images on right.

The fabricated surfaces are processed and used as heat exchanger surfaces. A video is presented here to show the excellent boiling performance of NMp surface.

More details about the technology can be found in the literature:

The use of a nano- and micro-porous surface layer to enhance boiling in a plate heat exchanger
R. Furberg, B. Palm, S. Li, M. Toprak and M. Muhammed
J. Heat. Trans., 131, 101010 (2009).

Nature-inspired fabrication of nanostructured micro-porous surfaces for enhanced boiling
Shanghua Li, Richard Furberg, Muhammet Toprak, Björn Palm and Mamoun Muhammed
Adv. Func. Mater., 18, 2215 (2008).

Dendritically ordered nano-particles in a micro-porous structure for enhanced boiling
Richard Furberg, Shanghua Li, Björn Palm, Muhammet Toprak and Mamoun Muhammed
Annals of the Assembly for International Heat Transfer Conference 13, Aug 13-18, Sydney/Australia, NAN-07 (2006).

Use of a novel nano- and micro-porous structure for enhanced boiling in a plate heat exchanger
Richard Furberg, Shanghua Li, Björn Palm, Muhammet Toprak and Mamoun Muhammed
Proceedings of 9th IEA Heat Pump Conference, May 20-22, Zurich/Switzerland, (2008).

Experimental investigation of an evaporator enhanced with a micro-porous structure in a two-phase thermosyphon loop
R. Furberg, R. Khodabandeh, B. Palm, S. Li, M. Toprak and M. Muhammed
Proceedings of ASME Summer Heat Transfer Conference, Aug 10-14, Jacksonville, Florida, USA, (2008).

Patent pending:

Porous layer on heat exchanger to increase surface area and heat transfer
R. Furberg, B. Palm, S. Li, M. Muhammed and M. Toprak
PCT Int. Appl. (2007), 56, CODEN: PIXXD2, WO 2007100297, A1 20070907, CAN 147:346365, AN 2007:998660

µΔT Surface

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